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Absolics, a South Korean company, is set to commence commercial production of specialized glass substrates in 2026 for AI chips used in data centers. This technology aims to improve energy efficiency and performance by allowing denser chip connections.

Intel is also integrating glass into its next-generation chip packaging, while other companies in South Korea and China adopt this innovation. The development is bolstered by a partnership with Georgia Tech, which received $175 million in grants from the CHIPS for America program. The glass substrate market is projected to grow significantly, with Absolics capable of producing 12,000 square meters annually, sufficient for 2-3 million Nvidia GPU H100 chip packages.