Absolics to Begin Commercial Production of Glass Substrates for AI Chips in 2026
South Korean company Absolics plans to start commercial production of specialized glass panels in 2026, aimed at enhancing the performance and energy efficiency of AI chips in data centers. The technology, supported by a partnership with Georgia Tech and funding from the CHIPS for America program, may allow for denser connections and reduced energy consumption. Major semiconductor firms, including Intel and Samsung, are also investing in glass packaging technology, signaling a shift in the semiconductor industry toward glass substrates.
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Absolics, a South Korean company, is set to commence commercial production of specialized glass substrates in 2026 for AI chips used in data centers. This technology aims to improve energy efficiency and performance by allowing denser chip connections.
Intel is also integrating glass into its next-generation chip packaging, while other companies in South Korea and China adopt this innovation. The development is bolstered by a partnership with Georgia Tech, which received $175 million in grants from the CHIPS for America program. The glass substrate market is projected to grow significantly, with Absolics capable of producing 12,000 square meters annually, sufficient for 2-3 million Nvidia GPU H100 chip packages.
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