Cadence Partners with Samsung Foundry and Arm to Launch Chiplet Ecosystem for AI and HPC
Cadence Design Systems has introduced a Chiplet Spec-to-Packaged Parts ecosystem to enhance engineering processes for AI, data center, and high-performance computing applications, collaborating with partners like Arm and Samsung Foundry. The initiative includes the development of a silicon prototype for a Physical AI chiplet platform, utilizing integrated partner IP on Samsung's SF5A process, and aims to streamline chiplet architecture generation in accordance with industry standards.
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Cadence Design Systems has launched a Chiplet Spec-to-Packaged Parts ecosystem aimed at simplifying engineering processes and accelerating development for physical AI, data center, and high-performance computing applications. Initial partners include Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, with silicon analytics support from proteanTecs.
The collaboration with Samsung Foundry involves creating a silicon prototype of the Physical AI chiplet platform using integrated partner IP on Samsung's SF5A process. Key components include the Arm Zena Compute Subsystem, enabling advanced edge AI processing for sectors like automotive and robotics.
Cadence's automation tools will generate chiplet architectures that comply with industry standards, including the Arm Chiplet System Architecture. An earlier prototype of the Cadence base system chiplet has been silicon validated.
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