China Innovates Diamond-Copper Cooling Technology for AI Chips
A composite material of diamond and copper enhances AI chip cooling efficiency by 80%, addressing critical thermal challenges in computing. This advancement marks a significant step towards reducing reliance on imported high-quality heat dissipation materials.
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Researchers at the Chinese Academy of Sciences have developed a diamond-copper composite that can increase cooling efficiency in AI data centers by up to 80%. This innovation addresses the thermal wall faced by the global computing industry as the next generation of AI chips generates excessive heat beyond traditional cooling systems' capacity.
The material has been implemented in an AI computing node in Zhengzhou, improving chip performance by 10%. With a thermal conductivity surpassing 1,000 W/mK, it significantly enhances heat transfer efficiency. Collaboration with Jiangxi Copper Company is underway to scale production using patented 3D composite technology, reducing reliance on imports for high-quality heat dissipation materials.
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