Article

Fraunhofer IPMS is enhancing its wafer contamination analysis capabilities with ultratrace elemental analysis. The new method employs vapor phase decomposition combined with inductively coupled plasma mass spectrometry (VPD-ICP-MS) to monitor wafer surface contamination.

After etching wafers with hydrofluoric acid vapor, a droplet is applied to collect soluble residues, which are analyzed to quantify 39 elements. The laboratory is equipped with advanced tools such as the WSPS2 Wafer Surface Preparation System and the iCap RQ mass spectrometer, reinforcing its position in semiconductor manufacturing quality assurance.