Great Lakes Semiconductor and APES Form Partnership for Advanced Semiconductor Packaging
Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have partnered to advance semiconductor packaging and heterogeneous integration. The initiative will establish a joint R&D center in Fishkill, NY, focusing on design-to-manufacturing services and mass customization of semiconductor devices. Key technologies include GLS's ChipForge™ and APES's Matrix6D AME platform, facilitating applications in various sectors. The collaboration begins immediately, transitioning to GLS facilities by Q3 2026, aiming to enhance North America's semiconductor supply chain.
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Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a partnership to focus on advanced semiconductor packaging and heterogeneous integration. They will set up a joint R&D center starting in Fishkill, NY, with plans to move operations to GLS facilities by Q3 2026.
The collaboration integrates GLS's ChipForge™ semiconductor platform with APES's Matrix6D AME platform, supporting applications in autonomous vehicles, medical devices, and robotics. The partnership aims to enhance the domestic semiconductor supply chain and improve manufacturing efficiency. GLS plans to become a fully integrated semiconductor company, developing technologies to address critical needs in North America's semiconductor industry.
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