Article

HRL Laboratories introduced Low-Chill, a 3D-printed direct liquid cooling (DLC) system developed with ARPA-E funding, aimed at improving data center thermal management. The system utilizes a printed manifold to route coolant through hundreds of short flow paths and operates as a single-phase system, simplifying infrastructure compared to two-phase systems.

Low-Chill increases cooling capacity by approximately 40% at equivalent pumping power and is scalable for multi-chip modules and next-generation processors. It targets operational constraints and energy consumption, providing higher thermal density without requiring facility redesign and promising lower energy demand and enhanced performance-per-watt.