HRL Laboratories Launches 3D-Printed Low-Chill Direct Liquid Cooling System for Data Centers
HRL Laboratories unveiled Low-Chill, a 3D-printed direct liquid cooling system funded by ARPA-E, enhancing data center thermal management. This system features a printed manifold that routes coolant through numerous short flow paths, achieving a 40% increase in cooling capacity at the same pumping power. Designed for scalability and compatibility with existing data center architectures, Low-Chill aims to reduce energy demand while improving performance-per-watt.
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HRL Laboratories introduced Low-Chill, a 3D-printed direct liquid cooling (DLC) system developed with ARPA-E funding, aimed at improving data center thermal management. The system utilizes a printed manifold to route coolant through hundreds of short flow paths and operates as a single-phase system, simplifying infrastructure compared to two-phase systems.
Low-Chill increases cooling capacity by approximately 40% at equivalent pumping power and is scalable for multi-chip modules and next-generation processors. It targets operational constraints and energy consumption, providing higher thermal density without requiring facility redesign and promising lower energy demand and enhanced performance-per-watt.
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