HyperLight, UMC, and Wavetek Form Partnership for High-Volume Production of TFLN Chiplet Platform
HyperLight Corporation, United Microelectronics Corporation (UMC), and Wavetek Microelectronics have announced a strategic partnership for the high-volume foundry production of HyperLight's TFLN Chiplet Platform. This collaboration focuses on manufacturing TFLN chips on 6-inch and 8-inch wafers to support AI and cloud infrastructure needs. The TFLN platform integrates various data center requirements and is designed for scalability, aiming to address the growing demand for optical interconnect technologies.
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HyperLight Corporation, UMC, and Wavetek have established a partnership to manufacture HyperLight's TFLN Chiplet Platform at high volumes on 6-inch and 8-inch wafers. This initiative aims to enhance manufacturing capacity for AI and cloud infrastructure.
HyperLight acts as the platform architect while UMC and Wavetek provide necessary foundry infrastructure. The TFLN platform merges specifications for different optical modules into a single architecture, promoting scalability.
UMC contributes its 8-inch production capabilities to meet the increasing demand for data center connectivity exceeding 1.6 terabits bandwidth. The TFLN technology is characterized by high modulation bandwidth and low optical loss.
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