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HyperLight Corporation, UMC, and Wavetek have established a partnership to manufacture HyperLight's TFLN Chiplet Platform at high volumes on 6-inch and 8-inch wafers. This initiative aims to enhance manufacturing capacity for AI and cloud infrastructure.

HyperLight acts as the platform architect while UMC and Wavetek provide necessary foundry infrastructure. The TFLN platform merges specifications for different optical modules into a single architecture, promoting scalability.

UMC contributes its 8-inch production capabilities to meet the increasing demand for data center connectivity exceeding 1.6 terabits bandwidth. The TFLN technology is characterized by high modulation bandwidth and low optical loss.