Imec Expands Photonic Integrated Circuits and Co-Packaged Optics Capabilities
Imec is enhancing its photonic integrated circuits (PICs) and co-packaged optics (CPO) to meet the demands of AI and datacom sectors. The company is advancing pluggable optical transceivers capable of 400-Gbit/s and 3.2-Tbit/s optics while integrating optical engines into ASIC packages to reduce power consumption and improve signal integrity. Imec also targets emerging applications in sensing and quantum computing, leveraging its ultralow-loss silicon nitride platform.
Theia Market Signal Identification - AI Assisted
Imec is focusing on improving photonic integrated circuits (PICs) and co-packaged optics (CPO) to support the AI and datacom industries. The company is developing technologies for pluggable optical transceivers that enable 400-Gbit/s per lane and 3.2-Tbit/s optics.
Their offerings include silicon waveguides, germanium silicon electro-absorption modulators, and advanced modulators. Additionally, Imec aims to integrate optical engines into ASIC packages to enhance efficiency and reduce signal integrity issues. The company is also exploring applications in sensing and quantum computing through its ultralow-loss silicon nitride platform.
Comments