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Morse Micro introduced the Design Partner Program at Embedded World 2026 to foster the commercialization of Wi-Fi HaLow solutions. The program aims to address the needs of IoT 2.0 by providing secure, long-range connectivity without additional complexity.

It formalizes collaboration with vetted design houses and system integrators to enhance deployment efficiency. Participants receive engineering support, structured onboarding, and design guidelines. The initiative will impact sectors like industrial IoT and smart infrastructure, with rollout scheduled for Q1 2026. Morse Micro's Wi-Fi HaLow technology offers ten times the range of traditional Wi-Fi, enhancing connectivity across various applications.