OKI Develops 180-Layer PCB Technology for AI Semiconductor Testing
OKI Circuit Technology has developed 180-layer, 15 mm-thick PCBs for next-gen AI semiconductor testing, enhancing capacity by 45%. Mass production is slated to begin in October 2026, addressing the growing demand for high-density data transfer in advanced semiconductor applications.
Theia Market Signal Identification - AI Assisted
OKI Circuit Technology (OTC) has successfully developed proprietary technologies for 180-layer, 15 mm-thick printed circuit boards (PCBs) designed for wafer testing equipment in AI semiconductors. This innovation represents a 45% increase in layer count and a doubling of thickness from the previous standard of 124 layers and 7.6 mm thickness.
Mass production is set to commence in October 2026 at the Joetsu Plant in Niigata Prefecture. OTC's new technologies include Sintering Paste for Via Bonding and a method for manufacturing ultra-high-thickness PCBs, enabling better control of via characteristics and improved power supply performance.
These advancements target sectors such as AI semiconductors, aerospace, and next-generation communications, which are poised for significant growth. The company will showcase these technologies at PCB East 2026 in Massachusetts.
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