Purdue University Receives $129,072 for Concrete, Imaging, and Semiconductor Innovations
Purdue University has secured $129,072 from the Trask Innovation Fund to advance projects in concrete, imaging, and semiconductors, with individual awards reaching up to $50,000. The funding will support the development of a hydrogel-based curing agent for concrete, enhancements in AI for digital pathology, and scaling the manufacturing of 2D tellurene for electronic devices. The next application deadline for Trask funding is February 20.
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Purdue University researchers have been awarded $129,072 from the Trask Innovation Fund for projects aimed at enhancing Purdue-owned intellectual property. The funding will support innovations in concrete, imaging, and semiconductors, with awards up to $50,000 per project.
Researchers are developing a new hydrogel-based curing agent for concrete to reduce shrinkage and cracking using upcycled waste materials. Additionally, a project in digital pathology aims to improve AI's capability in precision medicine by addressing bottlenecks in current imaging methods.
A further initiative focuses on scaling up the manufacturing of 2D tellurene to enable consistent production for advanced electronic devices. The next application deadline for Trask funding is February 20.
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