SCHMID Unveils Any Layer ET Process for Advanced Packaging at ECTC 2026
SCHMID Group has launched its Any Layer ET (Embedded Trace) Process aimed at enhancing panel-level advanced packaging. This innovation addresses the industry's growing demand for complex substrate solutions driven by AI and high-performance computing.
Theia Market Signal Identification - AI Assisted
SCHMID Group has introduced the Any Layer ET Process, a full panel-level damascene platform designed for advanced substrate manufacturing. This technology facilitates precise copper embedding within dielectric layers, enhancing electrical performance and surface planarity.
Key applications include advanced IC substrates, panel-level packaging, and high-density interconnects. The Any Layer ET platform incorporates several advanced processing techniques, including Deep Reactive Ion Etching (DRIE) and Chemical Mechanical Polishing (CMP).
SCHMID's commitment to innovation will be highlighted by Roland Rettenmeier's presentation at ECTC 2026 in Orlando, Florida, discussing future packaging architectures. This development positions SCHMID as a critical player in meeting the demands for high-volume manufacturing in the semiconductor sector.
Comments