TANAKA Develops Gold Bump Transfer Technology for Semiconductor Applications
TANAKA PRECIOUS METAL TECHNOLOGIES has announced a new gold bump transfer technology, AuRoFUSE™ Preforms, designed for sintered gold bonding on complex semiconductor chips and substrates. This method allows for the formation and transfer of gold bumps, facilitating application on intricate structures and improving reliability in high-density chips. The technology is aimed at enhancing semiconductor miniaturization and performance across various applications, including LEDs and MEMS.
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TANAKA PRECIOUS METAL TECHNOLOGIES has introduced AuRoFUSE™ Preforms, a gold bump transfer technology enhancing sintered gold bonding for semiconductor applications. The process involves forming gold bumps on a transfer substrate and subsequently transferring them to target semiconductor chips or substrates.
This method accommodates complex shapes and overcomes limitations of traditional processes. The AuRoFUSE™ technology allows bonding at lower temperatures (200℃) while maintaining high reliability and efficiency in heat dissipation. It aims to support the increasing demand for miniaturization and performance in semiconductors, particularly in devices like LEDs, smartphones, and MEMS.
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