Article

TANAKA PRECIOUS METAL TECHNOLOGIES has introduced AuRoFUSE™ Preforms, a gold bump transfer technology enhancing sintered gold bonding for semiconductor applications. The process involves forming gold bumps on a transfer substrate and subsequently transferring them to target semiconductor chips or substrates.

This method accommodates complex shapes and overcomes limitations of traditional processes. The AuRoFUSE™ technology allows bonding at lower temperatures (200℃) while maintaining high reliability and efficiency in heat dissipation. It aims to support the increasing demand for miniaturization and performance in semiconductors, particularly in devices like LEDs, smartphones, and MEMS.