TANAKA to Exhibit Semiconductor Solutions at SEMICON Southeast Asia 2026
TANAKA PRECIOUS METAL TECHNOLOGIES will showcase advanced semiconductor materials and circular economy initiatives at SEMICON Southeast Asia 2026. The exhibition, taking place from May 5 to 7, 2026, in Kuala Lumpur, Malaysia, emphasizes TANAKA's commitment to supporting next-generation semiconductor applications and sustainable practices.
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TANAKA PRECIOUS METAL TECHNOLOGIES will participate in SEMICON Southeast Asia 2026, scheduled for May 5-7, 2026, in Kuala Lumpur, Malaysia. The company will exhibit a variety of semiconductor materials, including bonding wires, silver sintering paste, and AgSn TLP sheets, aimed at enhancing semiconductor processes.
Key products include a conductive die-attach material compatible with silicon and next-generation semiconductors, featuring thermal conductivity exceeding 200 W/m·K. The bonding material supports large chip sizes and high-current applications, achieving bonding strength up to 50 MPa. These initiatives reflect TANAKA's focus on both semiconductor advancement and circular economy strategies, potentially influencing industry sustainability practices.
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