YINCAE Launches Dual-Cure Underfill for Optical Packaging Applications
YINCAE Advanced Materials has unveiled UF 66UV, a dual-cure underfill aimed at enhancing optical packaging without heat. This innovation is pivotal for industries reliant on optical clarity and mechanical stability in sensitive components.
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YINCAE Advanced Materials has introduced UF 66UV, a dual-cure underfill for optoelectronic and semiconductor applications. The material allows for assembly at room temperature, eliminating the need for initial heating, which is beneficial for delicate optical components.
It combines UV and thermal curing, achieving over 98% visible light transmittance and maintaining optical clarity post environmental testing, including Pressure Cooker Test (PCT) and lead-free reflow cycles at 260°C. Suitable for MicroLED displays, CMOS sensors, and medical devices, UF 66UV's characteristics support emerging technologies in photonics and semiconductors. Its performance under demanding conditions enhances optical efficiency and package reliability.
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