ZEISS Launches Crossbeam 750 FIB-SEM for Enhanced Sample Preparation
The ZEISS Crossbeam 750 FIB-SEM features advanced Gemini 4 optics for high-precision sample preparation, crucial for semiconductor and materials research. This system allows real-time imaging during milling, aiming to improve yield and consistency in lamella quality.
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ZEISS has introduced the Crossbeam 750 focused ion beam-scanning electron microscope (FIB-SEM), optimized for high-accuracy sample preparation workflows. This system features Gemini 4 electron optics, providing sub-nanometer precision for transmission electron microscopy (TEM) lamellae and advanced three-dimensional (3D) analysis capabilities.
The Crossbeam 750 enables real-time monitoring of FIB milling, reducing interruptions and improving lamella consistency. Its large, undistorted field-of-view enhances 3D tomography and accelerates data acquisition times. ZEISS allocates 15% of its revenue to research and development, underscoring its commitment to innovation in optics and related technologies, which is vital for the semiconductor and materials sectors.
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