Absolics Secures $100 Million U.S. Grant for Glass Substrate R&D
Absolics Inc. has been awarded $100 million by the U.S. government for R&D on glass substrates under the CHIPS Act. This funding positions Absolics as a key player in semiconductor technology and could enhance collaboration within the AI chip sector.
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Absolics Inc. received $100 million in R&D funding from the U.S. Department of Commerce through the National Advanced Packaging Manufacturing Program (NAPMP), part of the CHIPS Act. This consortium, which includes several leading U.S. tech firms, aims to advance glass substrate technology, critical for next-generation semiconductors.
Glass substrates, which offer over 30% power savings compared to plastic substrates, are expected to facilitate advancements in AI chip technology. Absolics aims to initiate mass production by the end of 2024, following the completion of its first production facility with a capacity of 12,000 square meters.
The funding represents approximately one-third of the total allocation for next-gen substrates, further solidifying Absolics’ position in the semiconductor market. The company's focus on glass substrates could catalyze broader industry adoption, enhancing the performance of AI applications.
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