Avicena Unveils LightBundle™ eKit for microLED Optical Interconnects in AI Infrastructure
Avicena has launched the LightBundle™ eKit, the first evaluation kit for microLED optical interconnects, aimed at AI infrastructure. This platform addresses limitations of copper interconnects in bandwidth and power efficiency, supporting applications in AI acceleration and high-bandwidth memory systems. The eKit supports 512 Gbps links and will be available to early-access partners in March 2026, with broader release expected in Q2 2026.
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Avicena has introduced the LightBundle™ eKit, the first evaluation platform for microLED optical interconnects. It is designed for AI infrastructure, targeting hyperscalers and AI accelerator architects.
The kit supports 512 Gbps links and aims to overcome the limitations of copper interconnects in bandwidth and energy efficiency. Key features include 320 microLED data channels, 256 active and 64 spare channels, and 5-meter and 10-meter optical fiber connectivity. The eKit will be available for early access in March 2026, with wider release planned for Q2 2026.
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