Chipbond Technology Opens $200 Million Semiconductor Facility in Penang, Malaysia
Chipbond Technology Corporation has inaugurated its new advanced semiconductor manufacturing facility in Penang, Malaysia, with an investment of approximately $200 million. The facility aims to enhance Malaysia's position in the global outsourced semiconductor assembly and test (OSAT) value chain and support local technology capabilities. The plant will focus on wafer bumping and chip-scale packaging, with expected internal qualification by the end of 2025 and customer qualification starting in Q1 2026.
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Chipbond Technology Corporation has opened a new semiconductor packaging and testing facility in Valdor Industrial Park, Batu Kawan, Penang, Malaysia, with a total investment of around $200 million. This facility is part of Chipbond's global expansion strategy and aims to strengthen Malaysia's role in the outsourced semiconductor assembly and test (OSAT) value chain.
The plant will support advanced semiconductor processes, including wafer bumping and wafer-level chip-scale packaging, with an initial monthly capacity of 10,000 wafers and 100 million WLSCP units. Internal qualification is expected by the end of 2025, followed by customer qualification in Q1 2026.
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