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Custom Interconnect Limited (CIL) has commenced construction of Stage 3 at its BP2 facility in Hampshire, targeting completion by June 2026. This expansion is driven by contract wins in semiconductor packaging and complex PCBA manufacture, with CIL's turnover expected to reach £45M this financial year, having tripled since 2021.

The BP2 facility includes five stages: Stage 1, completed in June 2023, established the UK's largest semiconductor packaging area; Stage 2, finishing in December 2024, will enhance PCBA manufacturing capacity. Stages 4 and 5 are planned for future expansion. CIL also plans to introduce new assembly equipment soon.