CIL Begins Stage 3 Development at BP2 OSAT Facility in Hampshire, UK
Custom Interconnect Limited (CIL) has started construction on Stage 3 of its BP2 facility in Hampshire, set to be operational by June 2026. This expansion follows recent contract wins in semiconductor packaging and PCBA manufacture. CIL's turnover has tripled since 2021, with a projected £45M for the current financial year. The facility consists of five stages, with Stage 1 completed in June 2023 and Stage 2 finishing in December 2024. Stages 4 and 5 will support future growth as needed.
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Custom Interconnect Limited (CIL) has commenced construction of Stage 3 at its BP2 facility in Hampshire, targeting completion by June 2026. This expansion is driven by contract wins in semiconductor packaging and complex PCBA manufacture, with CIL's turnover expected to reach £45M this financial year, having tripled since 2021.
The BP2 facility includes five stages: Stage 1, completed in June 2023, established the UK's largest semiconductor packaging area; Stage 2, finishing in December 2024, will enhance PCBA manufacturing capacity. Stages 4 and 5 are planned for future expansion. CIL also plans to introduce new assembly equipment soon.
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