Copper Plates Could Reduce Energy Consumption in Data Centers

A study from the University of Illinois at Urbana-Champaign reveals that copper plates can reduce cooling energy consumption in data centers. The new plates, developed using an electrochemical deposition method, demonstrated a 32% decrease in thermal resistance compared to traditional square fins and allowed pumps to use 68% less electricity for maintaining chip temperature.

However, the prototype is only 20x20 millimeters, much smaller than operational data center chips. The widespread adoption of these copper plates is contingent upon the fluctuating price of copper, which has risen significantly over the past year, posing a potential barrier to implementation.