Core Micro Systems to Showcase Next-Gen AI HPC Solutions at SCA/HPCAsia 2026 in Osaka
Core Micro Systems Inc. will serve as a Platinum sponsor at 'SCA/HPCAsia 2026' in Osaka, showcasing advanced AI HPC solutions designed for supercomputing. Key presentations will cover a Grid Scale-out AI HPC Modular Platform, a Global Multi-cloud AI HPC Resource Orchestration Solution, and innovations in container modular data centers aimed at enhancing integration and reducing costs. The company will also highlight its aisle-connected expandable container technology, which simplifies installation and supports significant cooling capacities.
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Core Micro Systems Inc. will be a Platinum sponsor of 'SCA/HPCAsia 2026', taking place from January 26 to 29, 2026, at the Osaka Prefectural International Convention Center. The company will present innovative AI HPC solutions that enhance AI-intensive supercomputing.
Key presentations include a Grid Scale-out AI HPC Modular Platform and Data Center Solutions by Kazuhiro Hirano, and a Global Multi-cloud AI HPC Resource Orchestration Solution by Chiaki Nishikawa. Core Micro Systems will also address the challenges of constructing AI HPC data centers, focusing on high integration, cost reduction, and shortened construction time. They will present their aisle-connected expandable container technology, which minimizes installation needs, and showcase a next-generation container modular data center capable of 500KW cooling and advanced cooling solutions achieving 1MW per container.
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