Empower Semiconductor Launches High-Density Silicon Capacitors for AI Chip Co-Packaging
Empower Semiconductor introduced three embedded silicon capacitors (ECAPs) designed for AI and HPC chips, enhancing power integrity by being co-packaged with processors. The EC2005P, EC2025P, and EC2006P offer capacitances of 9.34 μF, 18.68 μF, and 36.8 μF, respectively. These capacitors address the challenges posed by high current demands in AI workloads, improving transient response and voltage stability. Empower also announced integrated voltage regulators (IVRs) to further optimize power delivery, supporting the growing need for efficient power management in high-performance computing.
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Empower Semiconductor has launched a series of embedded silicon capacitors (ECAPs) aimed at enhancing power integrity for AI and high-performance computing (HPC) chips. The EC2005P, EC2025P, and EC2006P provide capacitances of 9.34 μF, 18.68 μF, and 36.8 μF, respectively.
These ECAPs are designed to be co-packaged with processors, addressing the need for stable power delivery as AI chips like NVIDIA's B200 and GB200 demand up to 2,700 W. Alongside the ECAPs, Empower introduced integrated voltage regulators (IVRs) to improve power delivery efficiency. Empower raised $140 million to scale production of its IVRs, which offer faster transient responses and reduced power losses.
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