EV Group Launches EVG®120 Resist Processing System for Enhanced Semiconductor Manufacturing
EV Group has introduced the next-generation EVG®120 automated resist processing system, featuring enhanced capabilities for high-volume manufacturing. The system, optimized for flexibility, includes in-situ resist thickness metrology, wafer edge exposure, and a compact design that improves throughput and process control. It will be showcased at the SPIE Advanced Lithography and Patterning Conference from February 22-26, 2026, in San Jose, California.
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EV Group has launched the EVG®120 automated resist processing system, designed for high-volume semiconductor manufacturing. The system features a compact 200-mm platform with up to two wet processing modules and 14 bake/chill plates, increasing capacity by 40% and reducing footprint by over 20%.
New capabilities include wafer edge exposure, in-situ resist thickness measurement, and enhanced high-viscosity dispense system. The EVG120 will be presented at the SPIE Advanced Lithography and Patterning Conference from February 22-26, 2026, in San Jose, California.
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