Article

EV Group has launched the EVG®120 automated resist processing system, designed for high-volume semiconductor manufacturing. The system features a compact 200-mm platform with up to two wet processing modules and 14 bake/chill plates, increasing capacity by 40% and reducing footprint by over 20%.

New capabilities include wafer edge exposure, in-situ resist thickness measurement, and enhanced high-viscosity dispense system. The EVG120 will be presented at the SPIE Advanced Lithography and Patterning Conference from February 22-26, 2026, in San Jose, California.