Article

At OFC 2026 in Los Angeles, FIBERSTAMP will unveil its O-band 400G DWDM4 optical modules, aimed at enhancing cost-effective data center interconnects. This technology leverages low-dispersion characteristics, making it suitable for DCI applications ranging from 2 km to 30 km.

The O-band solution eliminates the need for dispersion compensation modules, simplifies line card design, and reduces CapEx through a direct-detect architecture. Additionally, it offers ultra-low power consumption and latency improvements. FIBERSTAMP will demonstrate the system, showcasing its potential to lower network deployment costs by approximately 50%.