Indium Corporation Launches Indium12.9HF Solder Paste for Advanced Electronics Assembly
Indium Corporation has introduced Indium12.9HF solder paste designed specifically for fine-feature electronics and semiconductor packaging. The product enhances solder paste inspection yields and reduces voiding, supporting advanced component sizes.
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Indium Corporation has launched Indium12.9HF, a no-clean, halogen-free solder paste optimized for fine-feature electronics assembly and semiconductor applications. It supports printing for advanced component sizes such as 01005 and 008004 packages and is formulated for high stencil print transfer efficiency, improving SPI yields for high-density board designs.
The paste exhibits low voiding performance on OSP and ENIG finishes, enhancing thermal management and reliability. It conforms to IPC J-STD-004B classification ROL0 and J-STD-005A requirements, ensuring halogen-free compliance.
Indium12.9HF is available in various packaging options, with recommended refrigerated storage to maintain shelf life. Potential adoption of this material may streamline processes in high-tech sectors, while its compatibility with various solder alloys could enhance manufacturing flexibility.
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