Infineon Launches TDM24745T TLVR Module for High-Density AI Compute Power Delivery

Infineon Technologies AG introduces the TDM24745T, a quad-phase power module utilizing TLVR inductors to address the power demands of AI data centers. With a compact size of 9x10x5 mm³, it delivers over 2 A/mm² current density, supporting advanced GPU and AI processors. The module simplifies power architecture design, reduces output capacitance by 50%, and offers up to 320 A peak current. Compatible with Infineon’s digital multiphase controllers, it enhances efficiency in AI server designs and contributes to energy savings.

Published Mar 27, 2026

Infineon Technologies AG has launched the TDM24745T, a compact quad-phase power module equipped with TLVR inductors to meet the increasing power demands of AI data centers. Measuring 9 x 10 x 5 mm³, it boasts a current density exceeding 2 A/mm² and provides up to 320 A peak current.

AI-curated by Theia

The module integrates four power stages and decoupling capacitors, enhancing transient performance for next-gen AI processors. It reduces output capacitance requirements by up to 50%, allowing for more compact and efficient layouts. The TDM24745T is compatible with Infineon’s digital multiphase controllers, supporting scalable architecture in evolving AI environments.