Infineon Launches TDM24745T TLVR Module for High-Density AI Compute Power Delivery
Infineon Technologies AG introduces the TDM24745T, a quad-phase power module utilizing TLVR inductors to address the power demands of AI data centers. With a compact size of 9x10x5 mm³, it delivers over 2 A/mm² current density, supporting advanced GPU and AI processors. The module simplifies power architecture design, reduces output capacitance by 50%, and offers up to 320 A peak current. Compatible with Infineon’s digital multiphase controllers, it enhances efficiency in AI server designs and contributes to energy savings.
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Infineon Technologies AG has launched the TDM24745T, a compact quad-phase power module equipped with TLVR inductors to meet the increasing power demands of AI data centers. Measuring 9 x 10 x 5 mm³, it boasts a current density exceeding 2 A/mm² and provides up to 320 A peak current.
The module integrates four power stages and decoupling capacitors, enhancing transient performance for next-gen AI processors. It reduces output capacitance requirements by up to 50%, allowing for more compact and efficient layouts. The TDM24745T is compatible with Infineon’s digital multiphase controllers, supporting scalable architecture in evolving AI environments.
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