Kandou AI Secures $225M Series A Funding to Advance Copper-Based Interconnects for AI Infrastructure

Kandou AI has raised $225 million in a Series A funding round led by Maverick Silicon, with participation from SoftBank, Synopsys, Cadence, and Alchip Technologies. The funds will be used to address data movement challenges in AI infrastructure through innovative copper-based interconnect technologies. The company aims to enhance AI system performance and energy efficiency by developing products like Glasswing and CNRZ-5 Chord, which offer faster data transfer and lower power consumption. The investment values Kandou AI at $400 million.

Published Mar 25, 2026

Kandou AI closed a $225 million Series A funding round led by Maverick Silicon, with participation from SoftBank, Synopsys, Cadence, and Alchip Technologies. The funding will accelerate Kandou AI's development of copper-based interconnect technologies to address memory bandwidth bottlenecks in AI infrastructure.

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The company is focused on products like Glasswing, which links chip components, and CNRZ-5 Chord, which improves data transmission efficiency. This funding values Kandou AI at $400 million and follows significant advancements in its technology and global engineering capabilities, including a new design center in India.