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Karman Industries has introduced a 10 MW thermal processing unit (HPU) designed to cool AI data centers while recycling waste heat. This modular cooling system utilizes CO2, allowing for high-density infrastructure integration.

HPUs can extract excess heat from clusters and provide coolant below 30 °C without large water volumes. The system can convert waste heat into electricity if ambient air is cold or heat the coolant for central heating.

The CO2 cooling operates similarly to traditional air cooling but is more environmentally friendly. Karman's proprietary Kompressor technology claims up to 80% space savings over traditional cooling systems.

The HPUs are designed without PFAS chemicals and can operate on 800 VDC power. Karman raised $20 million in a Series A round led by Riot Ventures, bringing total funding to over $30 million. Shipments of HPUs are expected to begin in Q3 2026, with a production capacity of up to 1 GW/year, scalable to 4 GW/year.