Lace Secures $40M to Develop Helium Atom Beam Lithography for Advanced Chipmaking

Lace, a Norwegian startup backed by Microsoft, has raised $40 million to advance helium atom beam lithography, which could enable chip designs ten times smaller than current methods. The Series A funding round was led by Atomico and includes investments from M12, Linse Capital, and others. Lace aims to have a test tool operational in a pilot fabrication plant by 2029, potentially revolutionizing semiconductor manufacturing and enhancing AI processor performance.

Published Mar 24, 2026

Lace, a Norway-based chipmaking equipment startup backed by Microsoft, has raised $40 million in Series A funding to develop helium atom beam lithography technology. This innovative approach could allow chip manufacturers to create designs up to ten times smaller than current capabilities.

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Traditional lithography relies on light beams, whereas Lace's method uses a helium atom beam measuring approximately 0.1 nanometers. This precision may enable unprecedented transistor miniaturization, enhancing performance of advanced AI processors.

The funding was led by Atomico, with participation from M12 and others. Lace has plans to deploy a test tool in a pilot semiconductor fabrication facility by 2029.