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Lam Research Corp. and CEA-Leti have announced a multi-year agreement to advance the fabrication of next-generation Specialty Technology devices, including MEMS, 3D imaging, sensors, RF solutions, and photonics. The collaboration aims to explore novel multi-elemental materials and improve manufacturing processes for higher-efficiency compound semiconductors.

This partnership will leverage Lam's etch and deposition capabilities alongside CEA-Leti's expertise in device characterization. The focus will be on overcoming critical engineering challenges and optimizing fabrication solutions for AI and high-performance computing applications. This joint research builds on previous projects and aims to address the performance and power efficiency of specialty technologies in various electronic devices, with a particular emphasis on quantum optics.