Legrand and SENKO Collaborate on Infinium acclAIM Platform for Enhanced Fiber Connectivity
At OFC 2026, Legrand will present its Infinium acclAIM™ platform, which now features interoperability with SENKO's SN®-footprint connectivity. This collaboration enhances high-density fiber infrastructure, allowing up to 288 fibers per rack unit and supporting sustainable data center design by reducing components and material usage. The adapter solution improves deployment flexibility while maintaining performance. SENKO's Emerging Technologies Group will also focus on advanced photonic solutions for high-performance networking.
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Legrand's Infinium acclAIM™ platform will showcase expanded interoperability with SENKO's SN®-footprint connectivity at OFC 2026. The platform allows ultra-high-density fiber deployments of up to 288 fibers per rack unit, significantly improving density over conventional designs.
A new adapter solution enhances deployment flexibility by enabling seamless connectivity between the acclAIM backbone connector and SN footprint at the patch panel. This innovation supports more sustainable data center design by reducing components, minimizing material usage, and improving scalability. Additionally, SENKO's Emerging Technologies Group will develop advanced photonic solutions for future networking applications.
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