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Legrand's Infinium acclAIM™ platform will showcase expanded interoperability with SENKO's SN®-footprint connectivity at OFC 2026. The platform allows ultra-high-density fiber deployments of up to 288 fibers per rack unit, significantly improving density over conventional designs.

A new adapter solution enhances deployment flexibility by enabling seamless connectivity between the acclAIM backbone connector and SN footprint at the patch panel. This innovation supports more sustainable data center design by reducing components, minimizing material usage, and improving scalability. Additionally, SENKO's Emerging Technologies Group will develop advanced photonic solutions for future networking applications.