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Nvidia's GB200 platform, exceeding 120kW power density, compels server chassis manufacturers to transition from air-cooled designs to integrated liquid cooling systems. The Rubin platform, showcased at CES 2026, offers 100% liquid cooling with independent power racks, addressing infrastructure limitations.

Existing datacenter setups struggle with the required 120kW rack density, leading to the adoption of NVL36x2 configurations that incur higher operational costs. The NVL36x2 setup involves two racks with a combined 132kW capacity but is primarily air-cooled, complicating thermal management for chassis manufacturers.

Nvidia's decision for copper cabling over optical transceivers impacts supply chain dynamics, favoring connector manufacturers. The shift to liquid cooling and the Rubin design necessitate a complete overhaul of engineering capabilities, emphasizing fluid dynamics over traditional mechanical assembly, as companies adapt to increased power demands and evolving AI server requirements.