PaXini Secures RMB1 Billion for Tactile-Sensing Technology Expansion
PaXini has raised RMB1 billion in a funding round, increasing total funding to RMB3.5 billion. The investment will bolster R&D and capacity expansion to support overseas growth.
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PaXini has successfully raised RMB1 billion, bringing its total funding to RMB3.5 billion. The funding round was led by an unnamed global consumer electronics and semiconductor group, BOC International Investment, Kunpeng Fund, and Hexin Fangce, with additional participation from Dinghui Baifu, Chengdu Jiazi AI Fund, Jingming Capital, and Tianjin Rongguo Sheng.
Existing investor Zhílai Capital also increased its stake. The company reported shipping nearly 1 million tactile-sensing chips in the past year. This funding will primarily focus on enhancing R&D capabilities and expanding production to meet growing market demands.
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