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Samsung Electronics introduced its HBM4E chip at Nvidia's GTC 2026 conference, featuring support for 16 Gbps per pin and a bandwidth of 4.0 TB/s. This represents a significant upgrade from the previous HBM4 generation.

The launch underscores the strengthened collaboration between Samsung and Nvidia, which extends to AI processor manufacturing, including the Groq 3 chip. Samsung also presented its Hybrid Copper Bonding technology, enhancing chip efficiency. The exhibition featured three focus areas: AI Factories, Local AI, and Physical AI, reflecting Samsung's commitment to advancing global AI technologies.