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Semidynamics has announced its entry into full-stack AI infrastructure, unveiling high-performance inference silicon and vertically integrated systems. The company achieved silicon readiness at the 3nm node in December 2025, marking a significant milestone with TSMC that aims to deliver production-grade chips and systems.

The new silicon architecture includes an innovative memory subsystem to enhance efficiency in AI workloads, addressing bandwidth bottlenecks and supply constraints. Partnerships with organizations such as EuroHPC Joint Undertaking, HPE, Bull (Atos Group), Telefonica, Multiverse Computing, E4 Computer Engineering, and Megware support this initiative. Semidynamics’ strategy focuses on developing a comprehensive stack of chips, boards, and racks to cater to advanced multi-accelerator AI platforms in Europe, contributing to the region's digital sovereignty and technological autonomy.