Technological Institute and Heatflow Develop Energy-Efficient 3D-Printed Cooling Solution for Data Centers
Technological Institute and Heatflow have developed an energy-saving cooling solution for data centers using 3D printing, demonstrated in the AM2PC project. This new passive two-phase cooling system achieved a cooling capacity of 600 watts, surpassing the initial target of 400 watts.
The project addresses the rising energy consumption of data centers, particularly in countries like Ireland, where regulatory limits on energy use have been implemented. The cooling solution utilizes a thermosiphon principle that requires no pumps, thus consuming no energy for heat removal.
It effectively removes heat at temperatures between 60 and 80 degrees Celsius, allowing for reuse in district heating systems and various industrial processes. The AM2PC project has a total budget of DKK 10 million and runs from 2023 to 2025, involving partners from Denmark, Belgium, and Germany.
