Technological Institute and Heatflow Develop Energy-Efficient 3D-Printed Cooling Solution for Data Centers
The Technological Institute and Heatflow have unveiled an innovative energy-efficient cooling solution for data centers, achieved through 3D printing in the AM2PC project. This passive two-phase cooling system, which operates without pumps, has exceeded its cooling capacity target by reaching 600 watts, addressing the increasing energy demands of data centers, particularly in regions like Ireland. The project, with a budget of DKK 10 million, runs from 2023 to 2025 and involves collaboration among partners from Denmark, Belgium, and Germany.
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Technological Institute and Heatflow have developed an energy-saving cooling solution for data centers using 3D printing, demonstrated in the AM2PC project. This new passive two-phase cooling system achieved a cooling capacity of 600 watts, surpassing the initial target of 400 watts.
The project addresses the rising energy consumption of data centers, particularly in countries like Ireland, where regulatory limits on energy use have been implemented. The cooling solution utilizes a thermosiphon principle that requires no pumps, thus consuming no energy for heat removal.
It effectively removes heat at temperatures between 60 and 80 degrees Celsius, allowing for reuse in district heating systems and various industrial processes. The AM2PC project has a total budget of DKK 10 million and runs from 2023 to 2025, involving partners from Denmark, Belgium, and Germany.
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