Telkom Indonesia and F5 Sign MoU for AI Connectivity Solutions at MWC 2026
PT Telkom Data Ekosistem (NeutraDC) and F5, Inc. have signed a Memorandum of Understanding (MoU) to develop AI Connectivity solutions in Indonesia. The MoU was signed during the Mobile World Congress (MWC) 2026 in Barcelona. This partnership aims to integrate data center capabilities with AI security and managed services, enhancing digital infrastructure across Indonesia.
Theia Market Signal Identification - AI Assisted
PT Telkom Data Ekosistem (NeutraDC) signed a Memorandum of Understanding (MoU) with F5, Inc. to explore strategic collaboration on AI Connectivity solutions in Indonesia. The MoU was signed on March 3, 2026, during the Mobile World Congress (MWC) 2026 in Barcelona.
This partnership focuses on integrating data center capabilities and AI security to provide reliable managed services. The collaboration aims to develop hyperscale data centers, enhance connectivity solutions, and explore new business models while supporting Indonesia's digital ecosystem. Key figures involved include NeutraDC CEO Andreuw Th.A.F. and F5 Chief Revenue Officer Chad Whalen.
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