Article

Jun Wang, assistant professor at the University of Nebraska-Lincoln, is developing LincolnPak, a high-voltage semiconductor power module, with a $1.8 million grant from the U.S. Department of Energy. This module aims to improve energy efficiency in AI data centers by converting electricity directly to an 800-volt DC distribution bus, reducing conversion stages and energy loss.

The projected impact includes a 50% reduction in the power-conversion footprint, lower construction costs, and improved operational efficiency. Wang's team plans to move towards commercialization, potentially launching a startup to manufacture the modules.