ACM Research Secures Advanced Packaging Equipment Orders from Global Semiconductor Customers
ACM Research, Inc. has received multiple orders for advanced packaging equipment from global semiconductor and technology customers, including a leading OSAT customer in Singapore and a North American technology firm. Deliveries are scheduled for the first quarter of 2026 and later in the year. The orders highlight ACM's expansion in wafer-level and panel-level applications, particularly its Ultra C vac-p system for advanced fan-out panel-level packaging.
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ACM Research, Inc. has received several advanced packaging equipment orders from leading global semiconductor and technology firms. A prominent OSAT customer in Singapore has ordered multiple wafer-level systems, with deliveries set for Q1 2026.
Additionally, a panel-level vacuum cleaning tool order has come from a major semiconductor packaging manufacturer outside mainland China, also scheduled for Q1 2026. A North America-based technology customer has placed orders for more wafer-level systems for later this year. These orders signify ACM's growth in advanced packaging, particularly in relation to AI and HPC applications, and the introduction of its Ultra C vac-p panel-level cleaning system, which enhances yield and reliability in complex integrations.
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