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ACM Research, Inc. has received several advanced packaging equipment orders from leading global semiconductor and technology firms. A prominent OSAT customer in Singapore has ordered multiple wafer-level systems, with deliveries set for Q1 2026.

Additionally, a panel-level vacuum cleaning tool order has come from a major semiconductor packaging manufacturer outside mainland China, also scheduled for Q1 2026. A North America-based technology customer has placed orders for more wafer-level systems for later this year. These orders signify ACM's growth in advanced packaging, particularly in relation to AI and HPC applications, and the introduction of its Ultra C vac-p panel-level cleaning system, which enhances yield and reliability in complex integrations.