Air Liquide Partners with SK hynix for HBM Packaging Project
Air Liquide has signed a long-term contract with SK hynix to support a high-bandwidth memory packaging project, enhancing its semiconductor capabilities. The initiative includes a new nitrogen production facility in South Korea, scheduled to operate by late 2027, which will supply essential gases for advanced chip packaging.
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Air Liquide has entered a long-term agreement with SK hynix to advance the packaging of High Bandwidth Memory (HBM) chips, critical for AI technologies. A new nitrogen production facility, expected to begin operations by late 2027, will support SK hynix's P&T7 packaging and testing fab in Cheongju, Chungcheongbuk province.
This project follows Air Liquide's acquisition of DIG Airgas and represents an investment of nearly EUR 200 million. The collaboration aims to leverage Air Liquide's technologies for high-purity gases along with DIG Airgas's local expertise. The partnership underscores the growing need for strategic collaborations in the semiconductor industry to meet technological demands.
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