Boyd Showcases Liquid Cooling Leadership at Data Centre World London 2026
Boyd will exhibit at Data Centre World London 2026 from March 4-5, showcasing advanced liquid cooling solutions for AI data centers. Ryan J. McGlen will present on innovative cooling designs. Boyd aims to leverage its regional manufacturing and technical expertise to meet growing demand for high-performance computing in Europe.
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Boyd will participate in Data Centre World London 2026, held on March 4-5, to showcase its liquid cooling systems tailored for AI data centers, colocation environments, and hyperscale operators. The company will feature a presentation by Ryan J.
McGlen on future liquid cooling designs. With the rising demand for high-performance computing, Boyd aims to establish itself as a leading partner in Europe, offering manufacturing capabilities, technical expertise, and lifecycle services for liquid cooling implementations. Attendees can visit Boyd at booth C193 for discussions on AI cooling systems and European expansion.
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