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Boyd, a leader in energy-efficient cooling technologies, will showcase its latest liquid cooling systems for AI and high-density computing at Data Centre World London 2026, taking place on March 4-5 at ExCeL London. Ryan J.

McGlen will present a session titled 'Architecting the Data Center Cooling Circuit from 'Chip-to-Ambient'™'. Boyd's established European presence enables it to be a leading partner for advanced cooling infrastructure, combining manufacturing scale and engineering depth to support the growing demand in the European market.