Boyd to Showcase Liquid Cooling Solutions at Data Centre World London 2026
Boyd will present its advanced liquid cooling systems for AI data centers at Data Centre World London 2026 on March 4-5. The company aims to enhance Europe's AI infrastructure with scalable solutions. Ryan J. McGlen will deliver a technical session on future cooling designs. Boyd is positioned as a key regional partner for liquid cooling in Europe, supported by its engineering expertise and manufacturing scale.
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Boyd, a leader in energy-efficient cooling technologies, will showcase its latest liquid cooling systems for AI and high-density computing at Data Centre World London 2026, taking place on March 4-5 at ExCeL London. Ryan J.
McGlen will present a session titled 'Architecting the Data Center Cooling Circuit from 'Chip-to-Ambient'™'. Boyd's established European presence enables it to be a leading partner for advanced cooling infrastructure, combining manufacturing scale and engineering depth to support the growing demand in the European market.
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