Broadcom Develops First 2nm SoC for Fujitsu's FugakuNEXT Supercomputer
Broadcom has produced the first custom SoC using a 2nm process, intended for Fujitsu's FugakuNEXT supercomputer. The chip, manufactured by TSMC, features 144 Armv9 cores and advanced memory and connectivity technologies. Notably, it employs a 3.5D XDSiP packaging platform designed to enhance signal density and reduce power consumption. Broadcom aims to expand its role in the advanced semiconductor market, with additional XPU platforms set for production in late 2026 for other AI clients.
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Broadcom has introduced the first custom System on Chip (SoC) produced with a 2nm process, designated for Fujitsu's FugakuNEXT supercomputer. This SoC includes 144 Armv9 cores organized in four die and features advanced memory and connectivity options such as 12 DDR5 channels and PCI Express 6.0.
The distinct 3.5D XDSiP packaging platform enhances signal density and reduces power consumption. Broadcom's collaborative efforts with TSMC position it competitively within the semiconductor market, with plans to produce additional XPU platforms for AI clients in late 2026.
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