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CEA-Leti and NcodiN have announced a strategic partnership to advance NcodiN's optical interposer technology using a 300 mm integrated photonics process. This collaboration is designed to address a critical data-movement bottleneck in next-generation semiconductors, facilitating the transition from copper to optical interconnects for improved performance in AI applications.

NcodiN's platform, NConnect, utilizes the world's smallest laser on silicon and aims for ultra-dense integration and low energy operation. The partnership will leverage CEA-Leti's expertise to demonstrate compatibility with commercial-scale production, marking a significant milestone for optical interconnects in high-bandwidth computing and AI.