Article

The AM2PC research project, involving the Danish Technological Institute and Heatflow, has developed a 3D-printed cooling component that significantly reduces energy consumption for data center cooling. The system utilizes a passive two-phase cooling method, allowing for efficient heat transfer without pumps or fans.

The prototype achieved a cooling capacity of 600 watts, exceeding initial targets. The additive manufacturing process enables complex internal geometries that enhance heat transport. As modern GPUs and servers exceed traditional air cooling limits, this solution offers a passive method to dissipate heat, thus lowering cooling energy requirements.

The heat removed ranges from 60 to 80 degrees Celsius, making it suitable for integration into district heating networks, although this was not the project's primary focus. The technology demonstrates potential for creating more efficient and integrated data centers.