DeepX Unveils Low Power AI Chip at Korea-Singapore AI Connect Summit
DeepX showcased its low-power AI semiconductor technology at the Korea-Singapore AI Connect Summit in Singapore. The demonstration included an innovative 'butter test' proving low heat emission and a partnership with Baidu to supply 40,000 chips for robotics and automation.
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DeepX participated in the Korea-Singapore AI Connect Summit in Singapore on February 2, where it demonstrated its low-power AI semiconductor technology. The event, co-hosted by various ministries from Korea and Singapore, focused on AI cooperation strategies.
CEO Kim Nok-won highlighted the commercialization of AI technology in Hyundai's robots. DeepX's chip, DX-M1, was showcased in a 'butter demonstration' to illustrate its low heat emission, as evidenced by butter not melting atop the chip. Additionally, DeepX announced a partnership with Baidu to supply 40,000 chips for robotics and factory automation, with mass production set for this year.
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