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Intel has showcased its 'Thick Core' glass substrate integrated with EMIB packaging technology at NEPCON Japan. This innovation is positioned for data center applications, countering rumors of a halt in glass substrate development.

The new package features a 78mm x 77mm footprint with a 10-2-10 stack-up architecture, enabling dense wiring and the inclusion of two EMIB bridges for connecting multiple compute dies. This EMIB + glass substrate solution aims to enhance AI chip performance and support complex chiplet configurations.

Additionally, Intel and UMC are exploring a partnership to license Intel's Super MIM capacitor technology for AI applications, which is critical for advanced packaging processes. Super MIM technology addresses challenges in power noise and transient fluctuations in angstrom-class chips, potentially impacting UMC's technology capabilities in high-performance computing.