Intel Unveils High-Performance Glass Substrate with EMIB Technology at NEPCON Japan 2026
At NEPCON Japan 2026, Intel unveiled a new high-performance glass substrate featuring EMIB technology, tailored for AI accelerators and HPC solutions. The substrate, measuring 78 x 77 mm, supports complex multi-chiplet configurations and enhances connection density with a 10-2-10 structure, while also offering improved heat resistance and mechanical stability over traditional organic substrates. Intel reported successful testing with no SeWaRe issues, marking significant advancements in material science and production processes.
Theia Market Signal Identification - AI Assisted
At NEPCON Japan 2026, Intel introduced a new glass substrate featuring EMIB technology, designed for AI accelerators and HPC solutions. The substrate, measuring 78 x 77 mm, supports larger packages with approximately double the lattice area compared to traditional implementations, facilitating complex multi-chiplet configurations with over 1,700 mm2 of silicon for logic and memory.
It incorporates a 10-2-10 structure with ten redistribution layers, a central core of two 800 μm glass layers, and an additional ten layers below, improving connection density management. Two EMIB bridges are integrated into the glass core, enabling modular approaches with smaller, interconnected chiplets, crucial for data center GPUs and AI accelerators.
Intel reported no SeWaRe issues during testing, indicating advancements in material science and production processes. The glass substrate offers advantages over traditional organic substrates, including enhanced heat resistance and mechanical stability, supporting smaller bump pitches down to 45 micrometers.
Comments