LIG Nex1 and Boss Semiconductor Partner to Develop AI Chips for Drones and Robots

LIG Nex1 has signed a memorandum of understanding with Boss Semiconductor to develop and commercialize physical AI semiconductors for drones and robots. This partnership, established on November 28, aims to enhance cooperation in creating technologies essential for intelligent unmanned systems.

The collaboration focuses on developing high-performance system on chips (SoCs) and AI semiconductors that meet the operational requirements of autonomous drones and robots. LIG Nex1 plans to localize on-device AI semiconductors to reduce dependence on foreign technology and boost the domestic AI semiconductor industry for both defense and civilian applications. The initiative targets advancements in various sectors, including defense, industry, and logistics.